US 12,262,623 B2
Manufacturing method of display device
Daiki Nakamura, Atsugi (JP); Tomoya Aoyama, Atsugi (JP); and Kensuke Yoshizumi, Atsugi (JP)
Assigned to Semiconductor Energy Laboratory Co., Ltd., Atsugi (JP)
Filed by Semiconductor Energy Laboratory Co., Ltd., Atsugi (JP)
Filed on Jun. 17, 2022, as Appl. No. 17/842,979.
Claims priority of application No. 2021-108371 (JP), filed on Jun. 30, 2021.
Prior Publication US 2023/0006140 A1, Jan. 5, 2023
Int. Cl. H10K 71/20 (2023.01); H10K 50/11 (2023.01); H10K 50/813 (2023.01); H10K 50/844 (2023.01); H10K 59/12 (2023.01); H10K 71/00 (2023.01); H10K 71/40 (2023.01); H10K 71/60 (2023.01)
CPC H10K 71/233 (2023.02) [H10K 50/11 (2023.02); H10K 50/813 (2023.02); H10K 50/844 (2023.02); H10K 59/12 (2023.02); H10K 71/00 (2023.02); H10K 71/40 (2023.02); H10K 71/60 (2023.02); H10K 59/1201 (2023.02)] 10 Claims
OG exemplary drawing
 
1. A manufacturing method of a display device, comprising:
a first step of forming a first pixel electrode and a second pixel electrode each having a tapered shape;
a second step of depositing a first EL film over and in contact with a top surface and a side surface of each of the first pixel electrode and the second pixel electrode;
a third step of forming a first sacrificial film to cover the first EL film;
a fourth step of processing the first sacrificial film and the first EL film to expose the second pixel electrode and form a first EL layer over the first pixel electrode and a first sacrificial layer over the first EL layer;
a fifth step of depositing a second EL film over the first sacrificial layer and the second pixel electrode;
a sixth step of forming a second sacrificial film to cover the second EL film;
a seventh step of processing the second sacrificial film and the second EL film to expose the first sacrificial layer and form a second EL layer over the second pixel electrode and a second sacrificial layer over the second EL layer;
an eighth step of removing the first sacrificial layer and the second sacrificial layer; and
a ninth step of drying the first EL layer and the second EL layer,
wherein in the fourth step, the first EL film and the first sacrificial film are processed by dry etching,
wherein in the seventh step, the second EL film and the second sacrificial film are processed by dry etching, and
wherein in the eighth step, the first sacrificial layer and the second sacrificial layer are removed by wet etching.