US 12,262,601 B2
Light emitting display device and manufacturing method thereof
Chi Wook An, Hwaseong-si (KR); Seong Min Cho, Seongnam-si (KR); Mi-Ran Ji, Hwaseong-si (KR); Chan Young Kim, Hwaseong-si (KR); and Yeong Ho Lee, Hwaseong-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Dec. 7, 2020, as Appl. No. 17/113,837.
Claims priority of application No. 10-2020-0047919 (KR), filed on Apr. 21, 2020; and application No. 10-2020-0079129 (KR), filed on Jun. 29, 2020.
Prior Publication US 2021/0328107 A1, Oct. 21, 2021
Int. Cl. H10K 59/131 (2023.01); H10K 59/40 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 59/40 (2023.02)] 15 Claims
OG exemplary drawing
 
1. A light emitting display device comprising:
a substrate that includes a display area and a non-display area adjacent to the display area;
a lower pad electrode disposed on the substrate in the non-display area;
a planarization layer made of an organic material that overlaps a portion of the lower pad electrode; and
an upper pad electrode disposed on the lower pad electrode and overlapping at least a portion of the planarization layer, wherein
the planarization layer includes an opening that exposes an upper surface of the lower pad electrode,
the lower pad electrode and the upper pad electrode are electrically connected to each other through the opening,
the planarization layer includes:
an exposed portion where a first upper surface of the planarization layer does not contact the upper pad electrode; and
an overlapping portion that overlaps at least a portion of the upper pad electrode such that a bottom surface of the upper pad electrode directly contacts a second upper surface of the planarization layer at the overlapping portion,
a first height of the planarization layer at the first upper surface of the planarization layer at the exposed portion is lower than a second height of the planarization layer at the second upper surface of the planarization layer at the overlapping portion,
an inclined surface extending an entire distance from the first upper surface of the planarization layer at the exposed portion to the second upper surface of the planarization layer at the overlapping portion, and
an upper edge of the inclined surface directly contacts an edge of the portion of the upper pad electrode overlapping the overlapping portion of the planarization layer.