| CPC H10F 55/25 (2025.01) [H01L 25/167 (2013.01); H01L 2924/12041 (2013.01); H10F 30/225 (2025.01); H10F 77/407 (2025.01)] | 23 Claims |

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1. An optoelectronic module, comprising:
a substrate;
a covering member disposed on the substrate, the covering member comprising an upper cover portion, a peripheral sidewall portion connected to the upper cover portion, and an inside partition extending from the upper cover portion to the substrate and delimiting a first cavity and a second cavity, wherein the first cavity is separated from the second cavity;
a light emitting element, disposed on the substrate as corresponding to the first cavity; and
a light receiving element, disposed on the substrate as corresponding to the second cavity;
wherein the inside partition has a first inner wall surface located in the first cavity and a second inner wall surface located in the second cavity; and
wherein a first protruded-recessed structure is formed on the first inner wall surface and the first protruded-recessed structure is a periodic protruded and recessed structure.
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