CPC H05K 9/0022 (2013.01) [H01L 21/56 (2013.01); H01L 23/552 (2013.01); H01L 25/0655 (2013.01); H01L 25/165 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 9/0039 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/025 (2013.01); H05K 2203/1316 (2013.01)] | 20 Claims |
1. A module comprising:
a substrate having an upper main surface and a lower main surface arranged in an up-down direction;
a metal member including a plate-shaped portion provided on the upper main surface of the substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction;
a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member;
a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; and
a sealing resin layer provided on the upper main surface of the substrate and covering the metal member, the first electronic component, and the second electronic component, wherein
when viewed in the front-back direction, a line connecting a lower end of the plate-shaped portion in a left-right direction is defined as a lower side,
the plate-shaped portion is provided with one or more lower notches extending upward from the lower side,
the metal member further includes a plurality of foot portions, and
all of the plurality of foot portions extend forward from the lower side, or all of the plurality of foot portions extend backward from the lower side.
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