US 12,262,513 B2
Electronic device
Guochao Fu, Shenzhen (CN); Xiangyu Wei, Shenzhen (CN); and Yuanru Yang, Shenzhen (CN)
Assigned to HONOR DEVICE CO., LTD., Shenzhen (CN)
Appl. No. 18/016,530
Filed by Honor Device Co., Ltd., Shenzhen (CN)
PCT Filed Aug. 30, 2022, PCT No. PCT/CN2022/115946
§ 371(c)(1), (2) Date Jan. 17, 2023,
PCT Pub. No. WO2023/036020, PCT Pub. Date Mar. 16, 2023.
Claims priority of application No. 202111062755.0 (CN), filed on Sep. 10, 2021; and application No. 202111552791.5 (CN), filed on Dec. 17, 2021.
Prior Publication US 2024/0260235 A1, Aug. 1, 2024
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 25/18 (2023.01); H10K 59/80 (2023.01); H10K 59/95 (2023.01)
CPC H05K 7/20454 (2013.01) [G06F 1/203 (2013.01); H01L 25/18 (2013.01); H05K 7/20963 (2013.01); H10K 59/87 (2023.02); H10K 59/8794 (2023.02); H10K 59/95 (2023.02)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first surface component with a first surface, wherein the first surface forms an outer surface of the electronic device;
a heating device located on a first side of the first surface component facing away from the first surface; and
a first heat transfer assembly located between the heating device and the first surface component,
wherein heat is conducted from the heating device to the first surface component through the first heat transfer assembly, a heat insulation structure is arranged in the first heat transfer assembly, and a first orthographic projection of the heat insulation structure on the first surface overlaps with a second orthographic projection of the heating device on the first surface, and
wherein the first heat transfer assembly comprises a first heat conducting member with a first stack structure, the first stack structure is formed by first heat conducting material layers and first adhesive layers that are alternately arranged in sequence, and the heat insulation structure is arranged in the first adhesive layer.