CPC H05K 7/2039 (2013.01) [H05K 7/203 (2013.01)] | 19 Claims |
1. A two-phase immersion-type heat dissipation device, comprising:
a heat dissipation substrate having a first surface and a second surface that is configured to be in contact with a heating element immersed in a two-phase coolant, wherein the first surface is opposite to the second surface and is arranged away from the heating element; and
a plurality of reinforced fins integrally formed on the first surface of the heat dissipation substrate, wherein a thickness of each of the plurality of reinforced fins is less than 1 mm;
wherein a microstructure of the plurality of reinforced fins undergoes a predeformation process so as to be different from a microstructure of the heat dissipation substrate; wherein, according to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate, so as to determine orientations of each crystal grain of the plurality of reinforced fins to ensure a structural strength to withstand a pushing force from air bubbles in the two-phase coolant.
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