US 12,262,509 B2
Compliant thermal management devices, systems, and methods of fabrication thereof
Georgios Karamanis, Medford, MA (US); and Marc Scott Hodes, Cambridge, MA (US)
Filed by Transport Phenomena Technologies, LLC, Medford, MA (US)
Filed on Sep. 2, 2022, as Appl. No. 17/929,352.
Application 17/929,352 is a continuation of application No. PCT/US2021/020950, filed on Mar. 4, 2021.
Claims priority of provisional application 62/984,927, filed on Mar. 4, 2020.
Prior Publication US 2022/0418162 A1, Dec. 29, 2022
Int. Cl. H05K 7/20 (2006.01); H01L 23/427 (2006.01)
CPC H05K 7/20336 (2013.01) [H01L 23/427 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A thermal management device comprising:
a housing;
a diaphragm including a contact surface, the diaphragm supported along the housing, and the housing and the diaphragm defining a chamber enclosed relative to the contact surface;
at least one support in the chamber; and
a wick including a first portion and a second portion,
the first portion of the wick in contact with the housing,
the second portion of the wick disposed in the chamber, between the at least one support and the diaphragm, and,
in response to a force on the contact surface of the diaphragm, the diaphragm resiliently flexible relative to the housing and the at least one support, the resilient flexibility of the diaphragm biasing the contact surface of the diaphragm away from the at least one support in the chamber.