US 12,262,508 B2
Heat pipe for improved thermal performance at cold plate interface
Juha Paavola, Hillsboro, OR (US); Columbia Mishra, Mountain View, CA (US); Justin Huttula, Portland, OR (US); and Mark Carbone, Cupertino, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 18, 2020, as Appl. No. 17/127,355.
Prior Publication US 2021/0136956 A1, May 6, 2021
Int. Cl. H05K 7/20 (2006.01); B23P 15/26 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20336 (2013.01) [B23P 15/26 (2013.01); G06F 1/206 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H05K 7/20409 (2013.01); F28F 2275/04 (2013.01); F28F 2275/06 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A thermal exchange assembly comprising:
a cold plate configured to be directly coupled to a semiconductor device, the cold plate including a first window section that comprises a recessed or depressed portion of the cold plate and has a first window section depth that is a portion of a thickness of the cold plate; and
a heat pipe (HP) that is a separate structure from the cold plate, the HP being directly coupled to the cold plate,
wherein the HP includes a second window section that comprises a recessed or depressed portion of the HP and has a second window section depth that is a portion of a thickness of the HP,
wherein the second window section of the HP is disposed on the first window section, and
wherein a cavity is formed by the first window section depth and the second window section depth and comprises a space formed between the portion of the thickness of the cold plate and the portion of the thickness of the HP.