US 12,262,502 B2
Computing devices with improved thermal management
Ran Hasson Ruso, Tel Aviv (IL); Tahir Cader, Spokane Valley, WA (US); Elad Mentovich, Tel Aviv (IL); and Susheela Narasimhan, Fremont, CA (US)
Assigned to Mellanox Technologies, Ltd., Yokneam (IL)
Filed by Mellanox Technologies, Ltd., Yokneam (IL)
Filed on Oct. 18, 2022, as Appl. No. 17/968,447.
Prior Publication US 2024/0130069 A1, Apr. 18, 2024
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20136 (2013.01) [G06F 1/206 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A thermal management apparatus comprising:
a housing defining:
a first end; and
a second end opposite the first end;
an electronic component supported within the housing;
a primary inlet configured to receive a primary airflow having a first temperature; and
a secondary inlet configured to receive a secondary airflow having a second temperature, wherein the second temperature is different than the first temperature,
wherein the primary airflow and the secondary airflow are collectively configured to dissipate heat generated by the electronic component while maintaining an air temperature internal to the housing greater than a dew point associated with an interior of the housing.