US 12,262,486 B2
Electronic device cover and electronic device component
Yinzhong Tang, Dongguan (CN); Na Wang, Chengdu (CN); Shanjiu Chi, Dongguan (CN); and Zhengquan Wang, Chengdu (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed on Jul. 22, 2022, as Appl. No. 17/871,404.
Application 17/871,404 is a continuation of application No. PCT/CN2020/142419, filed on Dec. 31, 2020.
Claims priority of application No. 202010076923.0 (CN), filed on Jan. 23, 2020; and application No. 202010089378.9 (CN), filed on Feb. 12, 2020.
Prior Publication US 2022/0361346 A1, Nov. 10, 2022
Int. Cl. H05K 5/02 (2006.01)
CPC H05K 5/0213 (2013.01) 20 Claims
OG exemplary drawing
 
1. An electronic device cover, comprising:
a first air intake window disposed on the electronic device cover and comprising a portion of an air intake channel;
a first air exhaust window comprising a portion of an air exhaust channel;
an air return channel disposed inside the electronic device cover and coupling the air exhaust channel to the air intake channel;
a top panel;
a bottom panel;
a first side panel coupled to the top panel and the bottom panel and comprising an inner wall;
a baffle plate disposed on the inner wall, disposed orthogonal relative to the bottom panel, and comprising a first side and a second side, wherein the first side and the second side are opposite sides of the baffle plate, wherein the air intake channel is located on the first side, and wherein the air exhaust channel is located on the second side; and
a gap that is between the baffle plate and the bottom panel that forms a portion of the air return channel.