US 12,262,482 B2
Method of manufacturing component carrier and component carrier intermediate product
Marco Gavagnin, Leoben (AT); and Gernot Schulz, Graz (AT)
Assigned to AT&SAustria Technologie&Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on Aug. 3, 2022, as Appl. No. 17/817,256.
Application 17/817,256 is a continuation in part of application No. 15/929,330, filed on Apr. 27, 2020, granted, now 11,430,703.
Claims priority of application No. 19173014 (EP), filed on May 7, 2019.
Prior Publication US 2022/0377911 A1, Nov. 24, 2022
Int. Cl. H05K 3/46 (2006.01); H01L 21/48 (2006.01)
CPC H05K 3/4614 (2013.01) [H01L 21/4803 (2013.01); H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H05K 3/4632 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/068 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method of manufacturing a component carrier product, the method comprising:
providing a first electrically-insulating layer structure;
laminating and patterning a second electrically-insulating layer structure made of an at least partially uncured material on the electrically-insulating layer structure such that the second electrically-insulating layer structure remains at least partially uncured after the laminating and patterning,
wherein the patterning comprises forming recesses;
or additively manufacturing a second electrically-insulating layer structure made of an at least partially uncured material on the electrically-insulating layer structure such that the second electrically-insulating layer structure remains at least partially uncured after the additively manufacturing,
wherein the additively manufacturing comprises forming recesses;
providing or filling an electrically-conductive material in the recesses,
wherein the second electrically-insulating layer structure remains at least partially uncured after providing or filling the electrically-conductive material in the recesses;
arranging a component carrier section on the second electrically-insulating layer structure to obtain a component carrier intermediate product,
wherein the second electrically-insulating layer structure remains at least partially uncured after arranging the component carrier section on the second electrically-insulating layer structure; and
laminating the component carrier intermediate product so that the second electrically-insulating layer structure is cured and the component carrier product is obtained.