| CPC H05K 3/4007 (2013.01) [H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 3/0041 (2013.01); H05K 3/048 (2013.01); H05K 3/064 (2013.01); H05K 3/067 (2013.01); H05K 3/1216 (2013.01); H05K 3/1225 (2013.01); H01L 21/0331 (2013.01); H05K 1/0393 (2013.01); H05K 3/1283 (2013.01); H05K 3/3463 (2013.01); H05K 2203/043 (2013.01); H05K 2203/087 (2013.01); H05K 2203/166 (2013.01)] | 8 Claims |

|
1. A method of manufacturing an electrical device, comprising:
forming a patterned inorganic liftoff layer to expose a target electrode site on a softening polymer layer;
depositing an electrode layer on the inorganic liftoff layer and on the exposed target electrode site; and
removing the inorganic liftoff layer by a horizontal liftoff etch to leave the electrode layer on the exposed target electrode site.
|