US 12,262,478 B2
Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems
Jin Yang, Hillsboro, OR (US); and David Shia, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 13, 2021, as Appl. No. 17/473,915.
Prior Publication US 2021/0410292 A1, Dec. 30, 2021
Int. Cl. H05K 3/28 (2006.01); H05K 7/20 (2006.01)
CPC H05K 3/282 (2013.01) [H05K 7/20236 (2013.01); H05K 2203/0776 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
an electronic circuit board comprising electronic components thereon, a protective material coated on an exposed material of the electronic circuit board and the electronic components, the protective material being chemically inert with the exposed material, the protective material being chemically inert with an immersion bath cooling liquid that the electronic circuit board and electronic components are to be immersed within, wherein, a thermal cooling structure of one of the electronic components that is designed to transfer heat into the immersion bath cooling liquid is not coated with the protective material.