	US 12,262,477 B2
	Reprint apparatus for circuit board and reprint method using the same
Do Jae Yoo, Suwon-si (KR); Yong Gil Namgung, Suwon-si (KR); Jong Hoon Shin, Suwon-si (KR); Sang Soon Choi, Suwon-si (KR); and Young Chul An, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 17, 2023, as Appl. No. 18/111,154.
Claims priority of application No. 10-2022-0107543 (KR), filed on Aug. 26, 2022.
Prior Publication US 2024/0074065 A1, Feb. 29, 2024
Int. Cl. H05K 3/22 (2006.01); B23K 1/00 (2006.01); B23K 1/005 (2006.01); B23K 1/19 (2006.01); B23K 101/42 (2006.01)

CPC H05K 3/225 (2013.01) [B23K 1/0016 (2013.01); B23K 1/005 (2013.01); B23K 1/19 (2013.01); B23K 2101/42 (2018.08); H05K 2203/16 (2013.01)]

18 Claims

1. A reprint apparatus, comprising:

a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board;

a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and

a curing unit configured to cure the material filled in the defective portion,

wherein the defect checking unit is configured to calculate a volume of the defective portion,

wherein the material filling unit is configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount,

wherein the defect checking unit, the material filling unit, and the curing unit are integrally formed and are configured to move together from above the circuit board.