US 12,262,476 B2
Mounting device
Mitsutaka Inagaki, Anjo (JP); Shigeto Oyama, Kariya (JP); and Haruna Narita, Higashiura-cho (JP)
Assigned to FUJI CORPORATION, Chiryu (JP)
Appl. No. 17/628,087
Filed by FUJI CORPORATION, Chiryu (JP)
PCT Filed Jul. 19, 2019, PCT No. PCT/JP2019/028508
§ 371(c)(1), (2) Date Jan. 18, 2022,
PCT Pub. No. WO2021/014505, PCT Pub. Date Jan. 28, 2021.
Prior Publication US 2022/0322595 A1, Oct. 6, 2022
Int. Cl. B23P 19/00 (2006.01); H05K 13/04 (2006.01); H05K 13/08 (2006.01)
CPC H05K 13/0812 (2018.08) [H05K 13/041 (2018.08); H05K 13/0815 (2018.08)] 9 Claims
OG exemplary drawing
 
1. A mounting device used in a mounting system, the mounting device comprising:
a supply section configured to hold a component;
a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target;
a camera configured to capture an image of the mounting target from above;
a pickup/imaging section configured to capture an image of the component from below in a state of being picked up by the mounting section; and
a control section configured to
execute a missing predicted component process of determining a missing predicted component by using the image of the component in the state of being picked up by the mounting section captured by the pickup/imaging section,
execute a missing component inspection process of detecting whether the missing predicted component on the mounting target is a missing component or not by using the image of the mounting target captured by the camera, and
when the missing predicted component is missing, execute a remounting process to control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.