US 12,262,472 B2
Power module
Nam Sik Kong, Gyeonggi-do (KR); and Jun Hee Park, Gyeonggi-do (KR)
Assigned to Hyundai Motor Company, Seoul (KR); and Kia Corporation, Seoul (KR)
Filed by Hyundai Motor Company, Seoul (KR); and Kia Corporation, Seoul (KR)
Filed on Oct. 26, 2022, as Appl. No. 17/974,266.
Claims priority of application No. 10-2022-0069075 (KR), filed on Jun. 7, 2022.
Prior Publication US 2023/0397336 A1, Dec. 7, 2023
Int. Cl. H05K 1/14 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/145 (2013.01) [H05K 1/0203 (2013.01); H05K 2201/09036 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A power module comprising:
a chip;
an upper substrate and a lower substrate which are respectively disposed above and below the chip; and
a guide groove portion formed of a plurality of grooves which is recessively formed in the upper substrate and the lower substrate around a connection portion of the chip, the guide groove portion being configured to guide molten solder when the chip is bonded to the upper substrate and the lower substrate by a soldering process,
wherein the guide groove portion is formed such that the plurality of grooves is disposed to be spaced apart from each other so that each vertex and a portion of edges around each vertex of the chip are surrounded.