| CPC H05K 1/113 (2013.01) [H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 2201/095 (2013.01); H05K 2201/096 (2013.01)] | 23 Claims |
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1. A printed circuit board, comprising:
a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and
a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively, wherein at least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers, wherein the first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers,
wherein the through-via is spaced apart from wiring layers embedded inside in the first board among the plurality of first wiring layers, wherein the through-via extends from the one surface to the other surface of the first board and has a tapered shape in which a cross-sectional area thereof decreases from the one surface to the other surface of the first board, and wherein a portion of the other surface of the first board is an external portion of the printed circuit board.
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