US 12,262,469 B2
Copper-clad laminate plate and printed wiring board
Daisuke Nakajima, Ageo (JP); and Shota Kawaguchi, Ageo (JP)
Assigned to MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
Appl. No. 18/016,120
Filed by MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
PCT Filed Jul. 14, 2021, PCT No. PCT/JP2021/026506
§ 371(c)(1), (2) Date Jan. 13, 2023,
PCT Pub. No. WO2022/014648, PCT Pub. Date Jan. 20, 2022.
Claims priority of application No. 2020-121982 (JP), filed on Jul. 16, 2020; and application No. 2021-043924 (JP), filed on Mar. 17, 2021.
Prior Publication US 2023/0276571 A1, Aug. 31, 2023
Int. Cl. H05K 1/09 (2006.01); H05K 3/38 (2006.01)
CPC H05K 1/09 (2013.01) [H05K 3/384 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0723 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A copper-clad laminate comprising:
a surface-treated copper foil comprising a copper foil and a zinc-containing layer provided on at least one surface of the copper foil; and
a sheet-shaped fluororesin provided on the zinc-containing layer side of the surface-treated copper foil,
wherein the zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more, and
wherein when an interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by glow discharge optical emission spectrometry (GD-OES), an emission intensity ratio IZn/ICu, which is a ratio of an emission intensity of Zn referred to as IZn to an emission intensity of Cu referred to as ICu, is 3.0×10−3 or less, and an emission intensity ratio IZn/IM, which is a ratio of an emission intensity of Zn referred to as IZn to an emission intensity of the transition element M referred to as IM, is 0.30 or more and 0.50 or less.