US 12,262,467 B2
Printed circuit board including an insulating layer and a metal post
Tae Hong Min, Suwon-si (KR); and Eun Su Kwon, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 24, 2023, as Appl. No. 18/113,834.
Claims priority of application No. 10-2022-0099856 (KR), filed on Aug. 10, 2022.
Prior Publication US 2024/0057251 A1, Feb. 15, 2024
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0296 (2013.01) [H05K 2201/10227 (2013.01); H05K 2201/10984 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first insulating layer;
a first pattern buried in a surface of the first insulating layer, the first pattern having a first surface that is not covered by the first insulating layer; and
a metal post disposed on the first surface of the first pattern,
wherein the metal post includes a first metal layer disposed on the first surface of the first pattern and a second metal layer disposed on a surface of the first metal layer, and
the first metal layer and the second metal layer include different metals.