US 12,262,465 B2
Circuit board
Won Suk Jung, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 17/925,059
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed May 13, 2021, PCT No. PCT/KR2021/005995
§ 371(c)(1), (2) Date Nov. 14, 2022,
PCT Pub. No. WO2021/230671, PCT Pub. Date Nov. 18, 2021.
Claims priority of application No. 10-2020-0057182 (KR), filed on May 13, 2020.
Prior Publication US 2023/0189431 A1, Jun. 15, 2023
Int. Cl. H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0225 (2013.01) [H05K 1/116 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09827 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a first insulating layer;
a second insulating layer disposed on the first insulating layer;
a first via electrode passing through a partial region of the second insulating layer from an upper surface of the second insulating layer toward a lower surface of the second insulating layer; and
a first outer circuit pattern including a first pattern buried in an upper region of the second insulating layer adjacent to the upper surface of the second insulating layer and a second pattern protruded on the second insulating layer; and
wherein the first via electrode has a slope in which a width gradually decreases toward the first insulating layer;
wherein the first pattern overlaps with a slope of a portion having a largest width in the first via electrode while being spaced apart from the first via electrode in a horizontal direction and has a thickness smaller than a thickness of the first via electrode, and
wherein the second pattern does not overlap the first via electrode and the first pattern in the horizontal direction.