US 12,262,131 B2
Imaging device and imaging method
Kazutoshi Kodama, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/794,011
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jan. 14, 2021, PCT No. PCT/JP2021/001050
§ 371(c)(1), (2) Date Jul. 20, 2022,
PCT Pub. No. WO2021/153254, PCT Pub. Date Aug. 5, 2021.
Claims priority of application No. 2020-015168 (JP), filed on Jan. 31, 2020.
Prior Publication US 2023/0047180 A1, Feb. 16, 2023
Int. Cl. H04N 25/75 (2023.01); H04N 25/772 (2023.01); H04N 25/79 (2023.01)
CPC H04N 25/75 (2023.01) [H04N 25/772 (2023.01); H04N 25/79 (2023.01)] 21 Claims
OG exemplary drawing
 
1. An imaging device including a plurality of substrates to be stacked, the imaging device comprising:
a readout-only circuit disposed on a substrate different from a substrate having a pixel array unit including a plurality of photoelectric conversion elements disposed thereon, and configured to perform an operation of reading out electrical signals obtained through photoelectric conversion in the plurality of photoelectric conversion elements; and
a circuit disposed on a substrate different from the substrate having the readout-only circuit disposed thereon and configured to perform an operation other than an operation of the readout-only circuit based on the electrical signals, wherein a circuit portion having a power supply voltage exceeding a predetermined reference voltage in the circuit configured to perform the operation other than the operation of the readout-only circuit is disposed on a same substrate as that for the plurality of photoelectric conversion elements.