US 12,261,430 B2
Composite circuit protection device
Jack Jih-Sang Chen, New Taipei (TW); and Chang Hung Jiang, New Taipei (TW)
Assigned to FUZETEC TECHNOLOGY CO., LTD., New Taipei (TW)
Filed by FUZETEC TECHNOLOGY CO., LTD., New Taipei (TW)
Filed on Dec. 28, 2021, as Appl. No. 17/646,269.
Prior Publication US 2023/0208131 A1, Jun. 29, 2023
Int. Cl. H02H 9/02 (2006.01)
CPC H02H 9/026 (2013.01) 19 Claims
OG exemplary drawing
 
1. A composite circuit protection device, comprising:
a positive temperature coefficient (PTC) component that includes
a PTC layer having two opposite surfaces, and
first and second electrode layers respectively disposed on said two opposite surfaces of said PTC layer;
a solder that includes a first alloy material having a first melting point, and a second alloy material having a second melting point that is lower than said first melting point, each of said first and second melting points independently being greater than 190° C. and lower than 308° C.;
a diode component that is connected to said second electrode layer of said PTC component through said solder;
a first conductive lead that is bonded to said first electrode layer of said PTC component; and
a second conductive lead that is bonded to said diode component,
wherein said composite circuit protection device trips at an over-voltage that is lower than a sum of a rated voltage of said PTC component and a breakdown voltage of said diode component as determined at 1 mA.