US 12,261,411 B2
Semiconductor laser driving apparatus, electronic equipment, and manufacturing method of semiconductor laser driving apparatus
Kiyohisa Sakai, Kanagawa (JP); Hirohisa Yasukawa, Kanagawa (JP); and Nobuaki Kaji, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/636,421
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jul. 20, 2020, PCT No. PCT/JP2020/028047
§ 371(c)(1), (2) Date Feb. 18, 2022,
PCT Pub. No. WO2021/039199, PCT Pub. Date Mar. 4, 2021.
Claims priority of application No. 2019-157724 (JP), filed on Aug. 30, 2019.
Prior Publication US 2022/0294179 A1, Sep. 15, 2022
Int. Cl. H01S 5/0225 (2021.01); H01S 5/00 (2006.01); H01S 5/02218 (2021.01); H01S 5/0233 (2021.01); H01S 5/024 (2006.01); H01S 5/042 (2006.01)
CPC H01S 5/0225 (2021.01) [H01S 5/0014 (2013.01); H01S 5/02218 (2021.01); H01S 5/0233 (2021.01); H01S 5/02469 (2013.01); H01S 5/042 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor laser driving apparatus, comprising:
a substrate incorporating a laser driver;
a semiconductor laser mounted on one surface of the substrate;
connection wiring that electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less;
a diffusion plate that diffuses laser light irradiated by the semiconductor laser; and
a transparent conductive film formed on a predetermined surface of the diffusion plate,
wherein the laser driver drives the semiconductor laser to irradiate the laser light on a basis of an electric characteristic value of the transparent conductive film.