| CPC H01Q 21/28 (2013.01) [H01Q 1/2283 (2013.01)] | 20 Claims |

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1. An antenna module comprising:
a plurality of antennas;
a first printed circuit board (PCB) on which the plurality of antennas are disposed;
a second PCB on which one or more elements configured to process radio frequency (RF) signals are disposed; and
an adhesive material for coupling the first PCB and the second PCB,
wherein the first PCB comprises a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and
wherein the first PCB is disposed to provide coupling connection via the coupling structure of the first PCB and a coupling pad of the second PCB.
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