US 12,261,351 B2
Radio frequency module and communication device
Takanori Uejima, Kyoto (JP); Shogo Yanase, Kyoto (JP); Yuto Aoki, Kyoto (JP); and Yukiya Yamaguchi, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on May 3, 2023, as Appl. No. 18/311,377.
Application 18/311,377 is a continuation of application No. PCT/JP2021/037690, filed on Oct. 12, 2021.
Claims priority of application No. 2020-202632 (JP), filed on Dec. 7, 2020.
Prior Publication US 2023/0275338 A1, Aug. 31, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/526 (2013.01); H01Q 9/0414 (2013.01)] 18 Claims
OG exemplary drawing
 
2. A radio frequency module, comprising:
a module substrate;
an electronic component on a main surface of the module substrate;
a resin covering at least part of the main surface and at least part of a side surface of the electronic component; and
a first metal layer that is on a surface of the resin and is at a ground potential,
wherein the electronic component comprises:
a first surface in contact with the first metal layer,
a second surface facing the main surface,
a circuit portion at a position closer to the second surface than to the first surface, and
a second metal layer between the first metal layer and the circuit portion,
wherein the first metal layer is made of copper or an alloy containing copper, or is a multilayer body containing copper, and
wherein the second metal layer is made of titanium, tantalum, cobalt, tungsten, or an alloy containing at least one of titanium, tantalum, cobalt, and tungsten.