US 12,261,349 B2
Radar system for detecting surroundings, comprising a waveguide antenna made of a printed circuit board and a molded part
Markus Wintermantel, Lindau (DE)
Assigned to Continental Autonomous Mobility Germany GmbH, Ingolstadt (DE)
Appl. No. 18/043,650
Filed by Continental Autonomous Mobility Germany GmbH, Ingolstadt (DE)
PCT Filed Aug. 16, 2021, PCT No. PCT/DE2021/200111
§ 371(c)(1), (2) Date Mar. 1, 2023,
PCT Pub. No. WO2022/053114, PCT Pub. Date Mar. 17, 2022.
Claims priority of application No. 10 2020 211 254.1 (DE), filed on Sep. 8, 2020.
Prior Publication US 2023/0275336 A1, Aug. 31, 2023
Int. Cl. H01Q 1/22 (2006.01); G01S 7/03 (2006.01); G01S 13/931 (2020.01); H01P 5/107 (2006.01); H01Q 1/32 (2006.01)
CPC H01Q 1/2283 (2013.01) [G01S 7/032 (2013.01); G01S 13/931 (2013.01); H01P 5/107 (2013.01); H01Q 1/3233 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A radar system comprising:
a circuit board having at least one high-frequency component with at least one element for signal transmission and reception;
a molded part; and
at least one antenna for transmitting and receiving radar signals disposed on an upper side of the molded part,
wherein a connection between the at least one element for signal transmission and reception and the at least one antenna is realized by inner waveguides,
wherein the at least one element for signal transmission and reception is configured to emit signals in a direction of the circuit board or receive signals from the direction of the circuit board,
wherein the circuit board is permeable by radar waves in a region of the at least one emitting or receiving element,
wherein the molded part is arranged on the side of the circuit board opposite the at least one high-frequency component and is conductively connected to the circuit board,
wherein at least one hollow waveguide is formed by a depression on the side of the molded part facing the circuit board and a metallized surface of the circuit board,
wherein the at least one waveguide is fed from a permeable location of the circuit board, and
wherein the molded part consists of a metallized single-layer plastic part.