| CPC H01L 33/62 (2013.01) [H01L 27/156 (2013.01); H01L 33/10 (2013.01)] | 13 Claims |

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1. A micro-LED board, comprising:
a substrate;
wiring including a positive voltage input line and a negative voltage input line;
a first insulating layer;
a micro-light-emitting diode (micro-LED); and
a light-blocking layer including a metal layer configured to block laser light; wherein
the wiring, the first insulating layer, and the micro-LED are located on the substrate in an order of the wiring, the first insulating layer, and the micro-LED,
the micro-LED includes a positive electrode and a negative electrode spaced from each other in a plan view, the positive electrode and the negative electrode being located on a lower surface of the micro-LED,
the positive electrode is electrically connected the positive voltage input line with a positive electrode pad located on the substrate and a first connection wire,
the negative electrode is electrically connected to the negative voltage input line with a negative electrode pad located on the substrate and a second connection wire,
the light-blocking layer is located between the first insulating layer and the micro-LED, at least partially crosses a portion of the wiring directly below the micro-LED, and has an area that does not overlap the positive electrode and the negative electrode so that the light-blocking layer blocks the laser light not to reach the wiring when the laser light is irradiated to at least one of the first connection wire and the second connection wire for cutting the at least one of the first connection wire and the second connection wire, and
the light-blocking layer is a conductive layer connected to the negative voltage input line.
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