US 12,261,255 B2
Light-emitting modules and electronic devices including the same
Jia-Yuan Chen, Miao-Li County (TW); Tsung-Han Tsai, Miao-Li County (TW); Kuan-Feng Lee, Miao-Li County (TW); and Yuan-Lin Wu, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Dec. 19, 2023, as Appl. No. 18/544,727.
Application 18/544,727 is a continuation of application No. 17/366,456, filed on Jul. 2, 2021, granted, now 11,881,545.
Application 17/366,456 is a continuation of application No. 16/377,415, filed on Apr. 8, 2019, granted, now 11,088,306, issued on Aug. 10, 2021.
Prior Publication US 2024/0120451 A1, Apr. 11, 2024
Int. Cl. H01L 33/58 (2010.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 31/14 (2006.01); H01L 31/16 (2006.01); H01L 33/00 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/58 (2013.01) [H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 31/14 (2013.01); H01L 31/16 (2013.01); H01L 33/0012 (2013.01); H01L 33/005 (2013.01); H01L 33/0093 (2020.05); H01L 33/44 (2013.01); H01L 33/48 (2013.01); H01L 33/62 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic assembly, comprising:
a first circuit structure comprising a conductive structure;
a second circuit structure disposed on the first circuit structure;
a plurality of electronic elements disposed on the first circuit structure; and
a connecting element disposed on the first circuit layer structure,
wherein the connecting element is disposed between two adjacent ones of the plurality electronic elements and electrically connected to the second circuit layer structure and one of the two adjacent ones of the plurality of electronic elements.