US 12,261,249 B2
Method for producing an optoelectronic device
Maxime Boistard, Grenoble (FR); Philippe Gibert, Saint-Etienne-de-Crossey (FR); Frédéric Mayer, Voiron (FR); Eric Pourquier, Grenoble (FR); Sylvia Scaringella, Montbonnot-Saint-Martin (FR); and Clémence Tallet, Saint Egreve (FR)
Assigned to Aledia, Champagnier (FR)
Appl. No. 17/767,253
Filed by Aledia, Echirolles (FR)
PCT Filed Oct. 1, 2020, PCT No. PCT/EP2020/077472
§ 371(c)(1), (2) Date Apr. 7, 2022,
PCT Pub. No. WO2021/069288, PCT Pub. Date Apr. 15, 2021.
Claims priority of application No. 1911133 (FR), filed on Oct. 8, 2019.
Prior Publication US 2022/0367762 A1, Nov. 17, 2022
Int. Cl. H01L 33/50 (2010.01); H01L 21/306 (2006.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/504 (2013.01) [H01L 21/30625 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/005 (2013.01); H01L 33/62 (2013.01); H01L 2933/00 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of manufacturing an optoelectronic device comprising assemblies of light-emitting diodes (LED) having first and second assemblies and first blocks made of a first photoluminescent material, each covering one of the first assemblies, the method comprising:
forming a layer covering the first and second assemblies;
delimiting first openings in the layer to expose the first assemblies;
filling the first openings with the first photoluminescent material; and
performing a first chemical-mechanical polishing to delimit the first blocks, wherein the optoelectronic device comprises second blocks made of a second photoluminescent material, different from the first photoluminescent material, each covering one of the second assemblies;
after performing the first chemical-mechanical polishing to delimit the first blocks, delimiting second openings in the layer to expose the second assemblies;
filling the second openings with the second material; and
performing a second chemical-mechanical polishing to delimit the second blocks.