US 12,261,242 B2
Semiconductor chip and method for producing a semiconductor chip
Brendan Holland, Regensburg (DE)
Assigned to OSRAM Opto Semiconductors GmbH, Regensburg (DE)
Appl. No. 17/638,660
Filed by OSRAM Opto Semiconductors GmbH, Regensburg (DE)
PCT Filed Jul. 27, 2020, PCT No. PCT/EP2020/071109
§ 371(c)(1), (2) Date Feb. 25, 2022,
PCT Pub. No. WO2021/037457, PCT Pub. Date Mar. 4, 2021.
Claims priority of application No. 102019122945.6 (DE), filed on Aug. 27, 2019.
Prior Publication US 2022/0336701 A1, Oct. 20, 2022
Int. Cl. H01L 33/20 (2010.01); H01L 33/00 (2010.01); H01L 33/10 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/20 (2013.01) [H01L 33/005 (2013.01); H01L 33/10 (2013.01); H01L 33/62 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor chip comprising:
a semiconductor body having a first region, a second region, and an active region between the first region and the second region;
indentations in the first region;
a TCO material in the indentations;
a carrier; and
a reflector covering the indentations and the first region,
wherein the indentations of the first region are arranged on a side of the first region facing away from the carrier, and
wherein the TCO material is flush with a surface of the first region facing away from the active region.
 
9. A method for producing a semiconductor chip, the method comprising:
providing a carrier;
providing a semiconductor body having a first region, a second region, an active region between the first region and the second region, and indentations in the first region, wherein the indentations of the first region are arranged on a side of the first region facing away from the carrier;
applying a TCO material to the first region and into the indentations on the side of the first region facing away from the active region; and
thinning the TCO material from the side of the TCO material facing away from the first region by material removal,
wherein thinning exposes the first region, and
wherein the TCO material remains exclusively in the indentations.
 
12. A method for producing a semiconductor chip, the method comprising:
providing a carrier;
providing a semiconductor body having a first region, a second region, an active region between the first region and the second region, and indentations in the first region, wherein the indentations of the first region are arranged on a side of the first region facing away from the carrier;
applying a TCO material to the first region and into the indentations on the side of the first region facing away from the active region; and
thinning the TCO material from the side of the TCO material facing away from the first region by material removal,
wherein thinning comprises removing a portion of the first region.