US 12,261,194 B2
Display device and method for manufacturing the same
Kenichi Takemasa, Tokyo (JP)
Assigned to JAPAN DISPLAY INC., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on Mar. 4, 2022, as Appl. No. 17/686,430.
Claims priority of application No. 2021-046568 (JP), filed on Mar. 19, 2021.
Prior Publication US 2022/0302204 A1, Sep. 22, 2022
Int. Cl. H01L 27/15 (2006.01); H01L 27/12 (2006.01); H01L 33/62 (2010.01)
CPC H01L 27/156 (2013.01) [H01L 27/1266 (2013.01); H01L 33/62 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for manufacturing a display device comprising:
forming a drive circuit to drive an LED element on an insulating substrate;
forming a light absorbing layer on the drive circuit;
forming an insulating layer covering the light absorbing layer;
forming a connecting electrode electrically connected to the drive circuit;
arranging the LED element so that the connecting electrode is in contact with a terminal electrode of the LED element; and
bonding the connecting electrode and the terminal electrode by irradiating laser light through a semiconductor layer of the LED element to the light absorbing layer.