US 12,261,163 B2
Molded dies in semiconductor packages and methods of forming same
Jie Chen, New Taipei (TW); Hsien-Wei Chen, Hsinchu (TW); and Ming-Fa Chen, Taichung (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 23, 2021, as Appl. No. 17/383,971.
Claims priority of provisional application 63/172,349, filed on Apr. 8, 2021.
Prior Publication US 2022/0328467 A1, Oct. 13, 2022
Int. Cl. H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/5385 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/50 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A package comprising:
an interposer, wherein the interposer comprises a first redistribution structure;
a first die bonded to a first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond;
a second die bonded to the first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond;
an encapsulant around the first die and the second die;
a second redistribution structure;
a semiconductor substrate between the first redistribution structure and the second redistribution structure, wherein the first surface of the first redistribution structure is opposite to the semiconductor substrate; and
a plurality of solder balls contacting a second surface of the second redistribution structure that is opposite to the semiconductor substrate;
a passive device die directly bonded to the second surface of the second redistribution structure, wherein the plurality of solder balls extends farther from the interposer than the passive device die;
a package substrate comprising a plurality of contact pads directly bonded to the solder balls, wherein the plurality of contact pads are disposed in a solder resist;
an underfill around the plurality of solder balls and the passive device die, the underfill extending continuously from a lateral surface of the passive device die to the package substrate, the underfill further extending continuously from the second surface of the second redistribution structure to the package substrate; and
a plurality of stacked dies, wherein the plurality of stacked dies is directly bonded to the first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond, wherein the plurality of stacked dies and the second die each overlaps the passive device die.