US 12,261,156 B2
Electronic device
Hiroyoshi Kunieda, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on Jun. 14, 2022, as Appl. No. 17/839,928.
Application 17/839,928 is a continuation of application No. PCT/JP2021/000207, filed on Jan. 6, 2021.
Claims priority of application No. 2020-017921 (JP), filed on Feb. 5, 2020.
Prior Publication US 2022/0310571 A1, Sep. 29, 2022
Prior Publication US 2023/0154904 A9, May 18, 2023
Int. Cl. H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01)
CPC H01L 25/105 (2013.01) [H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/182 (2013.01); H01L 2924/186 (2013.01); H01L 2924/3511 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a circuit board;
a lower integrated circuit (IC) package in which a lower IC chip is sealed on a lower package substrate by a lower resin portion being mounted on the circuit board via a lower solder connection portion; and
an upper IC package in which an upper IC chip is sealed above an upper package substrate by an upper resin portion being mounted on the circuit board via an upper solder connection portion; wherein
a rigid body having a smaller coefficient of linear expansion in a plane direction than that of the upper resin portion is provided in the upper IC package, and
the rigid body is arranged directly above a boundary between the lower IC chip and the lower resin portion.