US 12,261,148 B2
Wire bonding apparatus
Shigeru Hayata, Tokyo (JP)
Assigned to SHINKAWA LTD., Tokyo (JP)
Appl. No. 18/008,179
Filed by SHINKAWA LTD., Tokyo (JP)
PCT Filed Jun. 1, 2021, PCT No. PCT/JP2021/020814
§ 371(c)(1), (2) Date Dec. 5, 2022,
PCT Pub. No. WO2021/246396, PCT Pub. Date Dec. 9, 2021.
Claims priority of application No. 2020-098350 (JP), filed on Jun. 5, 2020.
Prior Publication US 2023/0178510 A1, Jun. 8, 2023
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/78 (2013.01) [H01L 2224/78001 (2013.01); H01L 2224/78353 (2013.01); H01L 2224/78753 (2013.01); H01L 2224/78804 (2013.01); H01L 2224/78824 (2013.01); H01L 2224/78901 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A wire bonding apparatus comprising:
a bonding stage on which a bonding target is mounted;
a wire bonding unit comprising a capillary bonding a bonding wire to the bonding target, a capillary drive section reciprocating the capillary, and a first XY-stage causing the capillary and the capillary drive section to be moved along a two-dimensional plane intersecting a direction of the reciprocation;
an imaging unit imaging the bonding target mounted on the bonding stage and comprising a second XY-stage that is independent of the first XY-stage; and
a base to which the wire bonding unit and the imaging unit are attached,
wherein the wire bonding unit is attached to a first portion of the base,
the imaging unit is attached to a second portion that is different from the first portion of the base,
in the wire bonding unit, a reference point that represents a position of the wire bonding unit is provided on a surface that can be imaged by the imaging unit,
the base comprises a sub-frame and a main frame rising from the sub-frame,
the first XY-stage is attached to the sub-frame and the second XY-stage is attached to the main frame, and
the main frame is not directly in contact with the first XY-stage.