US 12,261,147 B2
Bonding system and bonding method
Akira Yamauchi, Kyoto (JP); and Tadatomo Suga, Tokyo (JP)
Assigned to Tadatomo Suga, Tokyo (JP); and BONDTECH CO., LTD., Kyoto (JP)
Filed by BONDTECH CO., LTD., Kyoto (JP); and Tadatomo Suga, Tokyo (JP)
Filed on Oct. 14, 2023, as Appl. No. 18/487,071.
Application 18/487,071 is a continuation of application No. 17/269,513, previously published as PCT/JP2018/042182, filed on Nov. 14, 2018.
Claims priority of application No. 2018-162738 (JP), filed on Aug. 31, 2018; and application No. 2018-205227 (JP), filed on Oct. 31, 2018.
Prior Publication US 2024/0079374 A1, Mar. 7, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01)
CPC H01L 24/74 (2013.01) [H01L 21/6838 (2013.01); H01L 24/80 (2013.01); H01L 21/67721 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/8022 (2013.01)] 1 Claim
OG exemplary drawing
 
1. A bonding method of bonding each of a plurality of second articles to a first article, wherein
each of the plurality of second articles is a chip comprising an uneven portion on a circumference closer to a bonding surface of the second article,
the bonding method comprises:
a step of transporting a second article in which the plurality of second articles are transported; and
a bonding step of bonding the plurality of second articles to the first article by bringing the plurality of second articles into contact with the first article,
in the step of transporting a second article, a portion opposite to the bonding surface on the uneven portion of at least one of the plurality of second articles is held by a holder for holding a second article, and the at least one second article is transported, and
the holder for holding a second article comprises a sloped surface that comes into contact with only a lower end portion of the uneven portion of the at least one second article when holding the at least one second article.