US 12,261,145 B2
Semiconductor device and methods of manufacturing semiconductor devices
Ji Yeon Ryu, Gyeonggi-do (KR); Jae Beom Shim, Incheon (KR); Tai Yong Lee, Gyeonggi-do (KR); and Byong Jin Kim, Seoul (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point (SG)
Filed on May 6, 2022, as Appl. No. 17/738,343.
Application 17/738,343 is a division of application No. 16/802,614, filed on Feb. 27, 2020, granted, now 11,355,470.
Prior Publication US 2022/0262762 A1, Aug. 18, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/433 (2006.01); H01L 23/492 (2006.01); H01L 23/495 (2006.01)
CPC H01L 24/40 (2013.01) [H01L 21/4875 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3135 (2013.01); H01L 23/367 (2013.01); H01L 23/4334 (2013.01); H01L 23/492 (2013.01); H01L 23/4951 (2013.01); H01L 2224/40247 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
an electronic component comprising:
a component face side;
a component base side;
a component lateral side connecting the component face side to the component base side;
a first component terminal on and overlapping the component face side; and
a second component terminal on and overlapping the component base side;
a first clip structure comprising:
a first clip pad having a first clip pad first face;
a second clip pad having a second clip pad first face coupled to the second component terminal; and
a first clip leg connecting the first clip pad and the second clip pad together;
an encapsulant covering the electronic component and at least portions of the first clip structure and having an encapsulant first face, wherein:
the first clip pad first face and the first component terminal are exposed from and substantially coplanar with the encapsulant first face;
a dielectric layer adjoining the encapsulant first face, the first clip pad first face, the component face side, and the first component terminal, wherein the dielectric layer comprises:
a first aperture extending through the dielectric layer, wherein the first clip pad first face is exposed within the first aperture; and
a second aperture extending through the dielectric layer, wherein the first component terminal is exposed within the second aperture;
a first external interconnect fixed on the first clip pad first face through the first aperture in the dielectric layer; and
a second external interconnect fixed on the first component terminal through the second aperture in the dielectric layer.