US 12,261,143 B2
Method of manufacturing substrate layered body and layered body
Yasuhisa Kayaba, Urayasu (JP); Jun Kamada, Narashino (JP); and Yuzo Nakamura, Chiba (JP)
Assigned to MITSUI CHEMICALS, INC., Tokyo (JP)
Appl. No. 17/284,833
Filed by MITSUI CHEMICALS, INC., Tokyo (JP)
PCT Filed Oct. 17, 2019, PCT No. PCT/JP2019/040845
§ 371(c)(1), (2) Date Apr. 13, 2021,
PCT Pub. No. WO2020/085183, PCT Pub. Date Apr. 30, 2020.
Claims priority of application No. 2018-202212 (JP), filed on Oct. 26, 2018; and application No. 2019-101252 (JP), filed on May 30, 2019.
Prior Publication US 2021/0391292 A1, Dec. 16, 2021
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/27 (2013.01) [H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/27015 (2013.01); H01L 2224/27515 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/0695 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/0715 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of manufacturing a substrate layered body, the method comprising:
applying a bonding material to a surface of at least one of a first substrate or a second substrate, wherein the bonding material includes a polymerizable compound;
curing the bonding material applied to the surface, to form a bonding layer having a reduced modulus at 23° C. of 10 GPa or less; and
bonding the first substrate with the second substrate via the bonding layer.