US 12,261,129 B2
Damping device and method of making
Jheng-Hong Jiang, Hsinchu (TW); Shing-Huang Wu, Hsinchu (TW); and Chia-Wei Liu, Zhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu (TW)
Filed on Jan. 24, 2022, as Appl. No. 17/582,091.
Claims priority of provisional application 63/225,429, filed on Jul. 23, 2021.
Prior Publication US 2023/0027657 A1, Jan. 26, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 27/146 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 27/14618 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a chip holder to support a chip; and
a damping device, comprising:
a damper;
a post, wherein a first end of the post is coupled to the damper and a second end of the post is coupled to the chip holder; and
a case, wherein:
the case defines a void in which the damper is disposed,
an opening is defined in a top surface of the case facing the second end of the post, and
the opening is separated from the post by a portion of the top surface of the case.