US 12,261,127 B2
Application of conductive via or trench for intra module EMI shielding
Anthony James LoBianco, Irvine, CA (US); Hoang Mong Nguyen, Fountain Valley, CA (US); Matthew Sean Read, Foothill Ranch, CA (US); Howard E. Chen, Anaheim, CA (US); Ki Wook Lee, Irvine, CA (US); and Yi Liu, San Diego, CA (US)
Assigned to SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Mar. 22, 2022, as Appl. No. 17/655,801.
Claims priority of provisional application 63/164,763, filed on Mar. 23, 2021.
Prior Publication US 2022/0310530 A1, Sep. 29, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4814 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49827 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A packaged semiconductor module having an integrated electromagnetic interference shield comprising:
a substrate having a ground plane;
an electronic device mounted on a surface of the substrate;
a bond pad disposed on the surface of the substrate and electrically connected to the ground plane;
a mold compound covering the electronic device;
a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound; and
a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive layer physically contacting the ground plane on a side of the mold compound, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.