US 12,261,110 B2
Electronic assembly having multiple substrate segments
Mengzhi Pang, Cupertino, CA (US); Shishuang Sun, Cupertino, CA (US); and Ganesh Venkataramanan, Sunnyvale, CA (US)
Assigned to Tesla, Inc., Austin, TX (US)
Filed by Tesla, Inc., Austin, TX (US)
Filed on Jun. 17, 2022, as Appl. No. 17/807,475.
Application 17/807,475 is a division of application No. 16/766,616, granted, now 11,367,680, previously published as PCT/IB2018/059537, filed on Nov. 30, 2018.
Claims priority of provisional application 62/596,217, filed on Dec. 8, 2017.
Prior Publication US 2022/0392836 A1, Dec. 8, 2022
Int. Cl. H01L 23/522 (2006.01); H01L 21/48 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5223 (2013.01) [H01L 21/485 (2013.01); H01L 23/36 (2013.01); H01L 23/49816 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 25/0652 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method for constructing an electronic assembly comprising:
obtaining a group of known good singulated substrates of a plurality of singulated substrates, wherein the substrates are singulated from a constructed panel;
joining, via a molding compound, the group of known good singulated substrates into a substrate panel,
wherein each of the known good singulated substrates includes a first plurality of conductors and a second plurality of conductors with a core sandwiched therebetween;
attaching at least one bridge to the substrate panel that electrically couples at least two of the known good singulated substrates of the group of known good singulated substrates; and
mounting a plurality of electronic components onto a first side of the substrate panel, each electronic component of the plurality of electronic components corresponding to a respective known good singulated substrate of the group of known good singulated substrates, wherein a fan out package is mounted to a second side of the substrate panel.