CPC H01L 23/49833 (2013.01) [H01L 23/13 (2013.01); H01L 23/293 (2013.01); H01L 23/367 (2013.01); H01L 23/3736 (2013.01); H01L 23/49838 (2013.01); H05K 3/0061 (2013.01); H01L 2224/97 (2013.01)] | 17 Claims |
1. A chip heat dissipating structure arranged on a chip, the chip heat dissipating structure comprising a plating layer covered on the chip, wherein the plating layer comprises a first metal layer and a second metal layer arranged in sequence, and
wherein the chip heat dissipating structure further comprises a heat sink connected with the plating layer,
wherein the chip comprises a wafer and a plastic encapsulating structure, the plating layer is covered on the wafer and the plastic encapsulating structure of the chip, and an upper surface of the wafer is exposed, and
wherein the heat sink is soldered to the plating layer through a solder layer, the solder layer being disposed between the heat sink and the plating layer;
wherein a connecting portion is arranged on the heat sink, the connecting portion is composed of a first plate and a second plate, the first plate and the second plate are arranged at a preset angle, wherein the preset angle is in a range of 180 degrees to 90 degrees, and at least one dissipating fin is fixedly arranged on an upper surface of the connecting portion; and
wherein the heat sink further comprises a bottom plate, the bottom plate is fixedly arranged on a lower surface of the connecting portion, and the bottom plate is soldered to a surface of the plating layer.
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