US 12,261,101 B2
Semiconductor package having wettable lead flanks and tie bars and method of making the same
Yan Xun Xue, Los Gatos, CA (US); Madhur Bobde, Sunnyvale, CA (US); Long-Ching Wang, Cupertino, CA (US); and Xiaoguang Zeng, Shanghai (CN)
Assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP, Toronto (CA)
Filed by ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP, Toronto (CA)
Filed on Jun. 28, 2022, as Appl. No. 17/852,356.
Prior Publication US 2023/0420340 A1, Dec. 28, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49562 (2013.01) [H01L 21/4835 (2013.01); H01L 21/4842 (2013.01); H01L 23/49565 (2013.01); H01L 23/49582 (2013.01); H01L 23/49513 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/182 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a lead frame comprising
a die paddle comprising
a first portion;
a second portion electrically isolated from the first portion; and
a third portion electrically isolated from the first portion and the second portion;
a first plurality of leads extending from the first portion of the die paddle along a first direction;
a first tie bar extending from the first portion of the die paddle along a second direction perpendicular to the first direction;
a second tie bar extending from the first portion of the die paddle along a third direction opposite the second direction;
a third tie bar extending from the second portion of the die paddle along the third direction; and
a semiconductor chip attached to the die paddle of the lead frame; and
a molding encapsulation enclosing the chip;
wherein a respective end surface of each lead of the first plurality of leads is plated with a metal; and
wherein a respective end surface of each of the first tie bar, the second tie bar, and the third tie bar is not plated with the metal.