US 12,261,100 B2
Cooling device
Hiroki Matsuda, Tokyo (JP); and Tsutomu Kawamizu, Tokyo (JP)
Assigned to MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo (JP)
Filed by MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo (JP)
Filed on Jun. 1, 2022, as Appl. No. 17/829,527.
Claims priority of application No. 2021-105567 (JP), filed on Jun. 25, 2021.
Prior Publication US 2022/0415756 A1, Dec. 29, 2022
Int. Cl. H01L 23/473 (2006.01); H01L 23/367 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 23/367 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A semiconductor component cooling device comprising:
a semiconductor component mounted on a surface of a substrate;
a base attached to a back surface of the substrate;
a bottom plate disposed spaced apart from the base; and
a plurality of fins protruding from the base, wherein
a recessed part recessed toward a substrate side is formed in a region that is a surface, of the base, facing a bottom plate side and is directly below the semiconductor component, and
a distance between fins provided in recessed part among the plurality of fins is narrower than a distance between the fins other than the fins provided in the recessed part.