US 12,261,098 B2
Immersion cooling electronic devices
Yongduk Lee, Vernon, CT (US); Ankit Gupta, Willimantic, CT (US); and Parag M. Kshirsagar, South Windsor, CT (US)
Assigned to Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed by Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed on Aug. 17, 2022, as Appl. No. 17/889,511.
Prior Publication US 2024/0063088 A1, Feb. 22, 2024
Int. Cl. H01L 23/44 (2006.01); H01L 23/473 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/445 (2013.01) [H01L 23/473 (2013.01); H05K 1/0203 (2013.01); H05K 7/20236 (2013.01); H05K 7/20272 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An embedded printed circuit board (PCB) assembly comprising:
a first PCB including at least one heat generating component;
a cooling path extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path, wherein the cooling path is in fluid communication with the at least one heat generating component;
a second PCB defining a perimeter wall about the cooling path, the second PCB sealed to the first PCB;
a third PCB including an inlet and an outlet for the cooling path, the third PCB sealed to the second PCB, the cooling path defined in an interior space bounded by the first, the second, and the third PCBs; and
one or more vias extending from an exterior surface of the third PCB, through the third PCB, through the second PCB, and through the first PCB to an exterior surface of the first PCB.