US 12,261,097 B2
Thermal management in integrated circuit packages
Feras Eid, Chandler, AZ (US); Telesphor Kamgaing, Chandler, AZ (US); Georgios Dogiamis, Chandler, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); and Johanna M. Swan, Scottsdale, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 8, 2023, as Appl. No. 18/366,734.
Application 18/366,734 is a continuation of application No. 16/533,152, filed on Aug. 6, 2019, granted, now 11,784,108.
Prior Publication US 2024/0030098 A1, Jan. 25, 2024
Int. Cl. H01L 23/427 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/38 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2023.01); H03H 9/46 (2006.01)
CPC H01L 23/427 (2013.01) [H01L 23/3157 (2013.01); H01L 23/373 (2013.01); H01L 23/38 (2013.01); H01L 23/481 (2013.01); H01L 23/66 (2013.01); H03H 9/46 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) package, comprising:
a package substrate;
a first component, wherein the first component is coupled to the package substrate, and the first component includes one or more resonators;
a second component, wherein the second component is coupled to the package substrate, and the second component includes one or more power amplifiers;
a heat spreader;
a cooling device, wherein the cooling device is closer to the first component than to the second component, and wherein the cooling device is a cooling device that is closest to the second component; and
a stack of vias in the package substrate in a footprint of the second component, wherein the vias are electrically isolated from all signal pathways in the IC package.
 
11. An integrated circuit (IC) assembly, comprising:
an IC package, and
a circuit board, coupled to the IC package,
wherein the IC package includes:
a package substrate;
a first component, wherein the first component is coupled to the package substrate, and the first component includes one or more resonators;
a second component, wherein the second component is coupled to the package substrate, and the second component includes one or more power amplifiers;
a heat spreader;
a cooling device, wherein the cooling device is closer to the first component than to the second component, and wherein the cooling device is a cooling device that is closest to the second component; and
a stack of vias in the package substrate in a footprint of the second component, wherein the vias are electrically isolated from all signal pathways in the IC package.
 
16. An integrated circuit (IC) package, comprising:
a package substrate;
a first component, wherein the first component is coupled to the package substrate, and the first component includes one or more resonators;
a second component, wherein the second component is coupled to the package substrate, and the second component includes one or more power amplifiers;
a heat spreader;
a cooling device, wherein the cooling device is closer to the first component than to the second component, and wherein the cooling device is a cooling device that is closest to the second component; and
a stack of vias in the package substrate in a footprint of the second component, wherein the vias are electrically isolated from all power pathways in the IC package.