CPC H01L 23/3128 (2013.01) [H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/367 (2013.01); H01L 23/49822 (2013.01)] | 20 Claims |
1. A semiconductor package, comprising:
a semiconductor device;
an encapsulating material encapsulating a first part of a side surface of the semiconductor device;
a redistribution structure disposed over the semiconductor device and a first side of the encapsulating material; and
an adhesive residue disposed over a second side of the encapsulating material opposite to the first side and surrounding the semiconductor device, wherein the adhesive residue encapsulates a second part of the side surface of the semiconductor device, wherein the adhesive residue is made of insulating adhesive material, reveals a back surface of the semiconductor device, the adhesive residue comprehensively covers and overlap with the second side of the encapsulating material, the adhesive residue comprises a central portion closer to the semiconductor device and a peripheral portion surrounding the central portion, and a maximum thickness of the central portion is greater than a maximum thickness of the peripheral portion.
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