US 12,261,076 B2
Wafer processing apparatus and wafer processing method
Seung Dae Baek, Hwaseong-si (KR); Sung Yup Kim, Suwon-si (KR); and Jun Goo Park, Hwaseong-si (KR)
Assigned to ZEUS CO., LTD., Hwaseong-si (KR)
Filed by ZEUS CO., LTD., Hwaseong-si (KR)
Filed on Apr. 14, 2022, as Appl. No. 17/720,760.
Claims priority of application No. 10-2021-0051543 (KR), filed on Apr. 21, 2021.
Prior Publication US 2022/0344196 A1, Oct. 27, 2022
Int. Cl. B08B 3/12 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/6838 (2013.01) [B08B 3/12 (2013.01)] 20 Claims
OG exemplary drawing
 
16. A wafer processing method comprising:
processing a first wafer part including a retainer ring portion and a plurality of sawn first-sawve dies in a first chamber unit;
processing a second wafer part including a wafer part and a carrier substrate in a second chamber unit; and
stacking and pre-bonding the first dies processed in the first chamber unit and the second wafer part processed in the second chamber unit in a third chamber unit.