US 12,261,075 B2
Substrate handling device for a wafer
Andreas Gleissner, Döbriach (AT); Manuel Eibl, Krispl (AT); and Herbert Oetzlinger, Hallwang (AT)
Assigned to SEMSYSCO GMBH, Salzburg (AT)
Appl. No. 17/630,642
Filed by SEMSYSCO GMBH, Salzburg (AT)
PCT Filed Jul. 30, 2020, PCT No. PCT/EP2020/071516
§ 371(c)(1), (2) Date Jan. 27, 2022,
PCT Pub. No. WO2021/019018, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 19189179 (EP), filed on Jul. 30, 2019.
Prior Publication US 2022/0262668 A1, Aug. 18, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/6838 (2013.01) [H01L 21/67288 (2013.01); H01L 21/67742 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate handling device for a wafer, comprising:
an end effector,
a straightening ring, and
a suction cup,
wherein the suction cup is arranged within the straightening ring,
wherein a first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply,
wherein the suction cup projects from the straightening ring in a normal pressure state, and
wherein the second part of the suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is directly contacted and held by the second part of the suction cup, so that the straightening ring also directly contacts the substrate,
characterised in that the straightening ring is releasably attached to the end effector, and also the suction cup is releasably attached to the end effector, and the straitening ring is exchangeable with another straightening ring, wherein the another straightening ring has a different height than the straightening ring.