US 12,261,074 B2
Info structure with copper pillar having reversed profile
Hsi-Kuei Cheng, Zhubei (TW); Ching Fu Chang, Taipei (TW); Chih-Kang Han, Hsinchu (TW); and Hsin-Chieh Huang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 16, 2023, as Appl. No. 18/336,263.
Application 15/894,523 is a division of application No. 15/390,226, filed on Dec. 23, 2016, granted, now 9,922,896, issued on Mar. 20, 2018.
Application 18/336,263 is a continuation of application No. 17/201,284, filed on Mar. 15, 2021, granted, now 11,984,342.
Application 17/201,284 is a continuation of application No. 16/410,183, filed on May 13, 2019, granted, now 10,950,478, issued on Mar. 16, 2021.
Application 16/410,183 is a continuation of application No. 15/894,523, filed on Feb. 12, 2018, granted, now 10,290,530, issued on May 14, 2019.
Claims priority of provisional application 62/395,528, filed on Sep. 16, 2016.
Prior Publication US 2023/0335426 A1, Oct. 19, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/683 (2006.01); H01L 21/288 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2023.01)
CPC H01L 21/6835 (2013.01) [H01L 21/288 (2013.01); H01L 21/31058 (2013.01); H01L 21/311 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/76834 (2013.01); H01L 21/76885 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/481 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/94 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0237 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/014 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/351 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a redistribution structure comprising redistribution lines therein, the redistribution structure including a first side and a second side opposite the first side;
at least one electronic component provided on and electrically connected to the redistribution structure;
a plurality of metal posts provided on the redistribution structure, wherein the plurality of metal posts are electrically connected with the redistribution structure, and wherein each of the plurality of metal posts comprises:
two opposite end faces; and
a sidewall surface adjoining the two opposite end faces and being narrower than the two opposite end faces; and
an encapsulation layer encapsulating the electronic component and the metal posts, wherein the encapsulation layer physically contacts the sidewall surface to form an interface; and
a plurality of conductors bonding the metal posts to the redistribution structure.