US 12,261,073 B2
Electrostatic chuck assembly for plasma processing apparatus
Maolin Long, Santa Clara, CA (US)
Assigned to Beijing E-Town Semiconductor Technology Co., Ltd., Beijing (CN); and Mattson Technology, Inc., Fremont, CA (US)
Filed by Beijing E-Town Semiconductor Technology Co., Ltd., Beijing (CN); and Mattson Technology, Inc., Fremont, CA (US)
Filed on May 3, 2024, as Appl. No. 18/654,429.
Application 18/654,429 is a continuation of application No. 17/551,247, filed on Dec. 15, 2021, granted, now 12,002,701.
Claims priority of provisional application 63/194,529, filed on May 28, 2021.
Claims priority of provisional application 63/194,256, filed on May 28, 2021.
Claims priority of provisional application 63/131,448, filed on Dec. 29, 2020.
Claims priority of provisional application 63/131,440, filed on Dec. 29, 2020.
Prior Publication US 2024/0282614 A1, Aug. 22, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/68 (2006.01); H01J 37/32 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32082 (2013.01); H01J 37/32577 (2013.01); H01J 37/32724 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A workpiece processing apparatus, comprising:
a processing chamber;
a workpiece support disposed in the processing chamber, the workpiece support including an electrostatic chuck, the electrostatic chuck comprising:
a workpiece support surface configured to support a workpiece during processing;
one or more clamping electrodes defining a clamping layer;
one or more heating electrodes defining a heating layer;
a thermal control system; and
a sealing band surrounding an outer perimeter of the electrostatic chuck including at least a portion of the workpiece support surface, the sealing band having a width greater than about 3 millimeters (mm) up to about 10 mm.